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RFQ
Assembly RFQ
Foundry RFQ
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Package Type
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BGA
HSBGA
PLCC
CLCC
QFN
QFP
fcBGA
LGA
Ceramic package
Other
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Wire Type
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Au
Al
Other
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Wire Thickness
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0.8 mils
1.0 mils
1.2 mils
Other
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Pin/Ball Count
Targeted Package Body Size
BPO Size
BPP Size
QTY Required to be Assembled
BG Required?
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No
Company Name
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Contact Number
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Tech Node
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0.18um
0.13um
0.11um
90nm
65nm
40nm
28nm
Other
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Tapeout Type
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MPW
MLM
Single reticle
Other
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MEM Option
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eFlash
ROM
MaskROM
EEPROM
Other
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Die QTY Required
Foundry
Other Process Option
Company Name
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Contact Number
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